Low-melt desolder alloy 1x16.5cm

Tap (16.5 cm) low-melt 49Bi/21In/18Pb/12Sn alloy to lower the soldering temperature of SMD components. This makes the use of an IR rework station / hot air station with years of soldering experience superfluous.

Suitable for phone repairs (iPhone, iPad, dock connector, FPC connector, coils, resistors, wifi holder, battery connector). Prevents damage to surrounding components and damaged copper pads.

Instructions

Delete component

• Provide all legs with no clean flux
• Melt some of this alloy on all legs (1 for 1), the temperature should be high enough to melt the original tin so that it mixes with the alloy. The next time this compound will melt much easier.
• Now heat the component all around. This will take little effort because the new alloy already melts at approx. 58 degrees. This can (not necessarily) also be done with hot air.
• The component can now easily be removed with tweezers.

Clean

• With a desoldering ribbon (litz) and flux the contact surfaces on the board can now be cleaned.
• After-cleaning possibly with flux remover and isopropanol (IPA), both also for sale with us.
• The new SMD component can now be repositioned using flux and solder tin/paste.