Products
Vaporflow 275 vapour phase reflow oven
The Vaporflow 275 is a reflow oven that uses vapour phase to reflow solder circuit boards. Problems that occur with small infrared or convection ovens are a thing of the past. Components with large thermal mass, fine pitch, or with black plastic are easily soldered using this oven.
The Vaporflow heats a special liquid to soldering temperature, creating a vapor that coats the circuit board. This vapor heats the circuit board very uniformly to 1 temperature. The uniform heating makes soldering circuit boards with various components very easy.
The Vaporflow provides a stainless steel container in which the circuit boards are placed on a tray. At the bottom of the kettle is a layer of liquid. The kettle is sealed with a lid. The vaporflow heats the liquid according to a pre-programmed profile. A sensor monitors the temperature inside the container. When the circuit board is soldered, the vapor is cooled again against the walls of the oven with powerful fans.
The soldering temperature is determined by the chosen vapor phase liquid. The standard liquid is Galden LS230, with which all common leaded and lead-free printed circuit boards can be soldered. The Vaporflow can handle all vapor phase liquids with temperatures between 180 and 240℃.
With the touch screen, the soldering process can be started and stopped. During soldering, a graph is displayed with the measured and set temperatures. All values can be logged to an SD Card. Custom soldering profiles can also be created for specific applications or fine-tuning.
The Vaporflow features multiple safeguards to prevent overheating. A sensor detects if the lid is placed.
The Galden liquid is expensive per liter, but its consumption in soldering is very low, so the overall running cost of the Vaporflow is low.
